SMT Assembly Equipment and Production Capabilities
REGULUS provides SMT assembly equipment and production resources for PCB assembly projects requiring high-speed component placement, fine-pitch handling, solder paste printing and SPI, multi-zone reflow, AOI, X-ray inspection, and related process control.
These production resources can be integrated into a broader manufacturing scope that includes PCB fabrication, component sourcing, visual inspection, cleaning, functional testing, and final assembly according to your project requirements. Both lead-free and SnPb PCB assemblies can be supported where applicable.
SMT Assembly Equipment for Placement, Printing and SPI
SMT production resources available for PCB assembly projects include high-speed placement equipment, automated solder paste printing, multi-zone reflow, and 3D solder paste inspection. These systems support component placement, solder deposition, thermal processing, and pre-placement inspection according to the applicable board design and process requirements.
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SMT Placement & Reflow Equipment: High-speed pick-and-place systems and multi-zone reflow ovens support automated component placement and controlled reflow processing for SMT assemblies.
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Automated Solder Paste Printing: Automated solder paste printers apply solder paste through the stencil according to the defined printing parameters.
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3D Solder Paste Inspection (SPI): 3D SPI equipment verifies solder paste volume and alignment before component placement, supporting early detection of printing variation.
Inspection, Testing, Tuning and Debugging Equipment
Inspection, electrical verification, tuning, and debugging resources are available according to the PCB assembly and product-level test requirements of each project.
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AOI & X-Ray Inspection: Automated Optical Inspection (AOI) supports inspection of visible component placement and soldering conditions, while X-ray inspection can be used for hidden solder joints such as BGA connections.
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In-Circuit Test (ICT): ICT equipment is available for component-value and electrical-connectivity verification where the board design and test access support the required test method.
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Diagnostic & Debugging Equipment: Oscilloscopes, signal generators, spectrum analyzers, and other applicable instruments support product tuning, signal analysis, and debugging according to project requirements.
For additional RF and product-level measurement resources, see our Tuning & Testing Equipment page.
Box Build Assembly Equipment
Equipment available for applicable box build projects supports PCB assembly integration with enclosure parts, dispensing, welding, sub-assembly, product verification, and final preparation.
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Mechanical & Product Integration: Box build lines, dispensing equipment, ultrasonic plastic welding, and related assembly resources support enclosure assembly and electro-mechanical integration.
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Programming, Burn-In & Final Preparation: Depending on project scope, production resources can support software loading, burn-in testing, final verification, packaging, and shipment preparation.
Review Your PCB Assembly Production Requirements
Need to confirm whether the available SMT assembly equipment supports your board design, component packages, production volume, inspection requirements, or testing scope? Provide your PCB files, BOM, assembly requirements, required quantities, and applicable inspection or testing criteria for project review.
SMT Assembly Line 1: Production Equipment List
1. SMT Assembly Equipment:
1) SMT High-Speed Chip Mounter
24 hours shifts w/ the capacity of 6 million R, C chip mounting
a. SONY G200AA MK3 @ 2 Sets
b. JUKI 2050L @ 1 Set
c. JUKI KE2050 @ 2 Sets
d. JUKI KE2060 @ 2 Sets
e. JUKI KE3020VRAL @ 1 Set
f. FUJI NXT M6-3 @ 12 Sets
2) Reflow Oven
a. 10 Zone Reflow Oven: ETC NC06M-102 @ 3 lines
b. 12 Zone Reflow Oven: ETC AC08M-12 @ 1 line
c. 8 sections of Reflow Soldering Oven @ 1 set
3) Gerber Converter Software @ 1 Set
4) Solder Paste Printer
a. Automatic: HETIANGUDE GD-2000 @ 3 Sets
b. Automatic: SINERJI SP710 @ 1 Set
c. Semi-Automatic: DERJIA DER-3040C2 @ 1 Set
5) DIP Assembly + Wave Soldering
a. JADE PRO DUPLEX JP038 @ 1 Set
b. JADE PRO DUPLEX JP039 @ 1 Set
6) De-paneling Machine
- MILLER-6600DS @ 1 Set
7) Automated and Semi-Automated
Conformal Coatings
- EVERPRECISION iL500 @ 1 set
8) Automated Laser Marking
- HGTECH LCB10C @ 1 set
9) Press-Fit Assembly
- Delta PRESS FIT @ 1 set
2. Equipment for Testing, Tuning and Debugging:
1) Spectrum analyzers
a. AGILENT 8594E (9 kHz-2.9 GHz) @ 1 Set
b. ADVANTEST R3465 9 kHz-3 GHz) @ 1 Set
c. ANRITSU MS2601B (9 kHz-2.2GHz) @ 1 Set
d. R313A @ 1 Set
e. KEYSIGHT E4405B ESA-E (9 kHz-13.2 GHz) @ 1 Set
2) Signal Generators
a. ANRITSU MG3601A @ 1 Set
b. GWINSTEKGFG-8020H @ 1 Set
c. KEYSIGHT 8657A @ 1 Set
d. KEYSIGHT 8647A @ 1 Set
e. MSG-2560B
f. VP-8177A
3) RF Shielded Enclosures @2 rooms
4) Digital Oscilloscope
a. GWINSTEK GDS-2064 @ 1 Set
b. GWINTEK GDS-2104 @ 1 Set
c. GWINTEK GOS-620 @ 2 Sets
d. TEKTRONIX TDS340A @ 1 Set
e. TEKTRONIX TDS3014B @ 1 Set
f. TEKTRONIX DPO-3014 @ 1 Set
g. IWATSU DS-8812 @ 1 Set
h. IWATSU SS-7821 @ 1 Set
I. IWATSU SS-7611 @ 1 Set
5) Burn-In Chamber @2 rooms
6) Automated Optical Inspection (AOI) Equipment
a. MVTEC MV8515M @ 1 Set
b. MVTEC MV8515 @ 1 Set
c. CYCLONE JUNIOR AOI @ 1 Set
7) 3D Solder Paste Inspection (SPI) Machine
- INSPIRE-510 @ 3 Sets
8) X-RAY Inspection Systems
- YXLON Cougar @ 1 set
3. Equipment for Box-build Assembly:
1) Two-Component (2K) Adhesive Dispenser
- WASON G-360S @ 1 Set
2) Touch Up, Box-build Assembly @ 4 lines
3) Liquid Dispensers
a. Single-component Type: PDT 8000 @ 2 Sets
b. Single-component Type: PDT 9000 @ 1 Set
4) Ultrasonic Plastic Welding Machine @ 1 set
- SUPERSONIC SUW-2615 @ 1 Set
5) Cleanroom @ 2 rooms
SMT Assembly Line 2: Production Equipment List
1. SMT Assembly Equipment:
1) Solder Printing Machine - Panasonic SPG @ 1 Set
2) SMT High-Speed Chip Mounter
a. Panasonic CM602 @ 3 Sets
b. i-PLUS M20 @1 Set
c. JUKI 2060 @2 Sets
d. JUKI 2080 @1 Set
3) Multi Functional Mounter - JUKI KE-2060 @ 1 line
4) Reflow Oven
a. ETC NE06-82M40 16 Zone @2 lines
b. TSK-5200 N2 @3 lines
5) De-paneling Machine - HS-JAW250 @1 Set
6) Selective Wave Soldering Machine - JADE Pro Duplex @ 6 Sets
7) Soldering Robot - EP300-SR @ 6 Sets
8) Lead Cutter - KA-66 @ 1 Set
9) BGA Rework Station - Fonton 936A @ 1 Set
10) LCM Hot-air Welding Machine - Avio TCW-215 @ 1 Set
11) Coating Machine - PVA Delta 6 @ 1 set
12) Automatic Loose Radial Lead Cutter - Renthang CF366 @ 1 Set
2. Equipment for Testing, Tuning and Debugging:
1) Automated Optical Inspection Equipment
a. OMRON S500 @1 set
b. OMRON RNS-pt @1 set
2) X-Ray - Scienscope View X2000 @1 set
3) X-Ray Counter Machine - VJ Electronix XQuik II @ 1 Set
4) Solder Paste Inspection Machine - Genitec GAM70 @ 1 Set
5) Reflow Temperature Tester - Tangteck PRO-600-6P @ 1 Set
6) ICT Inspection Machine - TRI TR-518FR @ 1 set
7) Comprehensive Tester - IFR 2945A @ 1 set
8) Spectrum Analyzer - HP 8591E @ 1 Set
9) High Frequency Signal Generator - HP 8648A @ 1 Set
10) GSM Simulator - Anritsu MT8820A @ 1 Set
11) Vibration Testing Machine - King Design 9363SP @ 1 Set
12) Shielded Enclosures @ 3 rooms
3. Equipment for Box-build Assembly:
1) Dispenser - Nordson Q-6800 @ 1 Set
2) Touch Up, Box-build Assembly @ 4 lines
