Where are rigid PCBs for REGULUS projects manufactured?

REGULUS coordinates rigid PCB manufacturing through qualified manufacturing partners in Taiwan and China. The manufacturing source is selected according to PCB technology, quality requirements, volume, lead time, and target budget.

What information is required for a PCB quotation?

For a PCB quotation, REGULUS normally requires a completed Product Survey, PCB/FPC Description File, and Gerber files. Key specifications should include board size, layer count, material, thickness, copper weight, surface finish, quantity, and any special requirements.

Can REGULUS support multilayer and HDI PCB manufacturing?

Yes. REGULUS supports multilayer and HDI PCB manufacturing, including blind vias, buried vias, microvias, and other advanced PCB structures, subject to design review and applicable manufacturing capabilities.

Can REGULUS support controlled-impedance PCB fabrication?

Yes. Controlled-impedance PCB fabrication can be supported based on the required impedance, PCB stack-up, applicable traces or layers, and tolerance requirements.

Can REGULUS provide PCB fabrication together with PCB assembly?

Yes. REGULUS can coordinate PCB fabrication with component sourcing, PCB assembly, inspection, testing, and box build assembly according to your project scope.

Rigid PCB Manufacturing for Multilayer and HDI Designs

REGULUS supports rigid PCB manufacturing through qualified manufacturing partners, covering bare-board fabrication for multilayer, HDI, controlled-impedance, and other rigid PCB designs. We review your PCB fabrication data and project requirements to coordinate an applicable manufacturing source. Support can be coordinated from prototype builds through volume production as your design, quantities, and production requirements develop.

The sections below summarize available fabrication capabilities, typical production processes, stack-up and via structures, and other technical options used to evaluate rigid PCB requirements.

Rigid PCB Fabrication Capabilities

Through qualified manufacturing partners, we can support multilayer and HDI structures, controlled-impedance designs, project-specific stack-ups, blind and buried vias, microvias, back drilling, and other rigid PCB fabrication requirements. Final feasibility depends on the design, materials, board construction, and capability of the applicable manufacturing source.

The capability table below summarizes available fabrication ranges for board construction, materials, copper thickness, trace and space requirements, via structures, surface finishes, and other PCB specifications.

Rigid PCB capability table covering layers, materials, copper thickness, vias, traces, and surface finishes.

Engineering Review & Manufacturing Source Coordination

At the RFQ stage, we review your PCB fabrication data for preliminary manufacturability issues that may affect fabrication feasibility, material selection, or quotation. This review can include the PCB stack-up, HDI structure, via design, controlled-impedance requirements, back drilling, and other fabrication conditions, evaluated against your project specifications and the capabilities of the applicable manufacturing source.

After the order and required project data are confirmed, a detailed DFM review is conducted as part of manufacturing preparation before production release. We also coordinate material availability and suitable manufacturing resources based on your PCB specifications, required quantities, quality requirements, and target schedule.

Typical Rigid PCB Fabrication Process

A typical rigid PCB fabrication flow includes inner-layer preparation, lamination, drilling, copper plating, outer-layer processing, solder mask, surface finishing, profiling, electrical testing, and final inspection. The actual process sequence varies according to the board structure, materials, layer count, via requirements, surface finish, and other project-specific fabrication conditions.

Rigid PCB production process from inner-layer preparation through drilling, plating, finishing, and final inspection.

Rigid PCB Stack-Up Structures

Rigid PCB stack-up defines the arrangement of copper layers and dielectric materials within the board. Layer count, dielectric structure, copper thickness, overall board thickness, impedance requirements, and via construction can all affect the applicable stack-up.

PCB stack-up diagram showing single-sided, double-sided, and multilayer rigid PCB structures.

HDI PCB Fabrication Capability

HDI rigid PCB designs can use microvias, blind and buried vias, and stacked or staggered via structures to support higher interconnection density and compact routing.

HDI PCB diagram showing stacked, staggered, blind, buried, microvia, and through-hole via structures.

Back Drilling for Rigid PCBs

Back drilling removes the unused portion of a plated through hole after the PCB has been drilled and plated. It can be used when a design requires a shorter via stub.

Rigid PCB back-drill diagram showing removal of an unused plated-through-hole via stub.

Via Types for Rigid PCBs

Rigid PCB designs may use plated through holes, blind vias, buried vias, or microvias depending on routing density, layer interconnection, board structure, and fabrication requirements.

Rigid PCB via diagram showing PTH, stacked microvia, microvia, and buried via structures.

Rigid PCB Products Portfolio

Our experience coordinating PCB manufacturing supports a diverse range of rigid circuit board projects with different layer structures, routing densities, board formats, and fabrication requirements. The examples below show rigid PCB products from our projects with different technical configurations.

Green rigid PCB panel with dense parallel copper traces, plated holes, and multiple connector pad ro

Blue rigid PCB with multiple parallel circuit sections, dense traces, and a central square pad area.

Green rigid PCB with a large central square pad, dense connector pads, and multiple mounting holes.

Red rigid PCB panel with repeated circuit sections, plated holes, and dense copper routing.

Green rigid PCB with two large square pad areas, dense routing, and multiple connector footprints.

Black rigid PCB with white silkscreen, dense component pads, plated holes, and routed board edges.

Start Your Rigid PCB Fabrication Review

Preparing a rigid PCB RFQ? Please submit your completed Product Survey, PCB/FPC Description File, Gerber files, required quantities, and applicable special fabrication requirements through our PCB Inquiry.

We will review your project information and clarify any engineering or fabrication questions needed before quotation.

PCB Inquiry

Rigid PCB Manufacturing FAQ

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