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Rigid-Flex PCB Manufacturing for Multilayer Circuit Boards

REGULUS supports rigid-flex PCB manufacturing through qualified manufacturing partners. A rigid-flex printed circuit (RFPC), commonly referred to as a rigid-flex PCB, combines rigid PCB sections and flexible circuit layers within one interconnected board structure.

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This integrated structure can reduce separate connectors and interconnection wiring while supporting compact product layouts and flexible installation.

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We review your rigid-flex PCB design data and project requirements to coordinate an applicable manufacturing source based on the board structure, materials, fabrication requirements, quantities, quality requirements, and target schedule.

RFPC Fabrication Capabilities

Available rigid-flex PCB fabrication capabilities cover prototype and volume requirements for multilayer designs that combine rigid and flexible circuit sections.

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Key fabrication conditions can include:

  • Multilayer structures: Rigid and flexible sections integrated within the same circuit board.

  • Fine features: Trace and spacing requirements according to applicable fabrication capability.

  • Materials and layer construction: FR-4, polyimide, copper, prepreg, coverlay, and other project-specific materials.

  • Electrical requirements: Controlled impedance based on specified targets, stack-up, trace geometry, and tolerances.

  • Flexing requirements: Static or dynamic flex conditions and bending requirements depend on the intended use and flex-area design.

  • Quality requirements: Inspection and acceptance criteria depend on the project specifications and applicable fabrication requirements.

 

The capability table below summarizes available rigid-flex PCB fabrication ranges. Final feasibility is confirmed against your Gerber files and fabrication specifications.

Rigid-flex PCB capability table with panel size, layers, copper, fine features, vias, coverlay, shielding, and impedance.

RFPC Stack-Up Structures

A rigid-flex PCB stack-up combines rigid board sections and flexible circuit layers within one interconnected structure. Layer construction must account for both the electrical requirements of the circuit and the mechanical requirements of the flexible sections.​

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  • Rigid sections: FR-4 cores, copper layers, prepreg, and solder mask are used according to the required board construction.

  • Flexible sections: Polyimide-based flex layers provide the flexible portion of the circuit, with copper and coverlay defined according to the design.

  • Rigid-flex transition: The layer construction between rigid and flexible areas is defined according to the approved stack-up and fabrication requirements.​

Rigid-flex PCB stack-up with FR-4 rigid sections, polyimide flex layers, copper, prepreg, coverlay, and solder mask.

RFPC Products Portfolio

Rigid-flex PCBs are commonly used where compact routing, reduced interconnection, or flexible installation is required. Typical applications can include:

  • Medical Electronics: Wearable monitoring devices and compact imaging equipment

  • Industrial Automation: Robotics, controllers, and sensor systems

  • Communication Equipment: Networking and communication hardware

  • Consumer Electronics: Foldable and other space-constrained electronic devices

 

The examples below show rigid-flex printed circuit boards from our projects with different rigid-flex configurations, board shapes, and interconnection layouts.

Start Your Rigid-Flex PCB Fabrication Review

Preparing a rigid-flex PCB RFQ? Please submit your completed Product Survey, PCB/FPC Description File, Gerber files, required quantities, and applicable special fabrication requirements through our PCB Inquiry.

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We will review your project information and clarify any engineering or fabrication questions needed before quotation.

Rigid-Flex PCB FAQ

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