top of page

Lead-free PCB Assembly (SMD/SMT)

The lead-free process requires that boards to be assembled at higher temperatures, usually 30-50 degrees or higher. The higher temperature may require the substrate or laminates of the circuit board itself and various components to be modified to withstand the higher temperatures in the oven. In addition, the IC moisture sensitivity level that indicates how long the board can be exposed to the air is approximately 2 classes higher for lead-free boards. The shelf life of the materials used in lead-free boards may also be shorter.

Lead Free

Technologies

  • IPC Class 2, 3 Lead-Free Processes

  • µBGA, PGA, LGA, BGA, PoP and 01005s

  • Press-Fit Assembly

  • Automated and Semi-Automated Conformal Coatings

  • Automated Laser Marking

Test Capabilities

  • Test System Development

  • ICT & 5DX

  • Functional & AOI

  • ESS & Flying Probe

  • Burn-In Chambers

Lead-free PCB Assembly Product Portfolio

PCB Assembly Line

Regulus Electronics Ltd.​

​凱元電子股份有限公司

 

總公司:

24158 新北市三重區光復路2段69號7F
工廠:

22103 新北市汐止區大同路3段188號

Headquarters:

7F, No.69, Sec.2, Guangfu Road, Sanchong Dstr, New Taipei, Taiwan (ZIP: 24158)
Factory:

No.188, Sec.3, Datong Road, Xizhi Dstr, New Taipei, Taiwan (ZIP: 22103)

TEL: +886 (2) 2760 1601

FAX: +886 (2) 2277 1827

Email: sales@reguluspec.com

Skype: sales@reguluspec.com

Web: www.regulus-ems.com​

LinkedIn: regulus-taiwan

ISO 9001:2015

Afnor Certified ISO 9001:2015
ISO Certification QR Code

Membership

TEEMA Logo
IPC Logo
TAQHSA Logo

Find Us On

Wireless and RF Logo
Power Electronics Logo
SMTNET Logo
PCB Directory Logo
QMed Logo
Design News Logo
Medical Device Directory Logo
Plastics News Logo
TechDirectory Logo
  • LinkedIn
  • YouTube
  • Facebook

2021. All rights reserved by Regulus Electronics Ltd.

bottom of page