PCB Assembly Capabilities for Prototype to Volume Production
REGULUS supports PCB assembly from engineering prototypes and low-volume builds through ongoing volume production. Our PCB assembly capabilities include SMT, THT/DIP, press-fit, mixed-technology and double-sided assembly, component package handling, inspection, functional testing, and project-specific reliability testing.
For broader turnkey manufacturing scope and RFQ information, see our PCB assembly services.
PCB Assembly Types & Production Volumes
We support different PCB assembly methods and production volumes according to your board design, component types, mechanical requirements, and project stage.
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SMT Assembly: Automated high-speed placement for compact, high-density PCB designs, including fine-pitch components.
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THT / DIP Assembly: Through-hole and DIP component insertion and soldering for connector-based, higher-current/power, or mechanically stressed applications.
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Press-Fit Assembly: Solderless insertion of compliant-pin components into applicable plated through holes for mechanical retention and electrical interconnection.
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Mixed Technology: Integration of SMT, THT/DIP, and press-fit assembly processes on the same PCBA for designs combining surface-mount components, through-hole parts, and solderless interconnects.
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Double-Sided Population: Component placement and soldering on both sides of the PCB to support higher circuit density and compact product designs.
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Flexible Volume: We support engineering prototypes, low-volume builds, and ongoing volume production.
Component Package Capabilities
Our PCB assembly lines support a wide range of component packages and form factors:
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Small Form Factor: Passive components down to 01005.
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Integrated Circuits: Assembly support for SOIC, PLCC, QFP, QFN, PGA (Pin Grid Array), and LGA (Land Grid Array) packages.
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Advanced Packaging: Mounting and reflow for µBGA, BGA, and PoP (Package on Package) technologies.
Lead-Free and Leaded Assembly Processes
We support both lead-free and leaded (SnPb) PCB assembly according to your product, regulatory, and end-use requirements.
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Lead-free Assembly (RoHS): Uses lead-free soldering processes and applicable materials for projects requiring RoHS-compliant assembly.
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Leaded (SnPb) Assembly: Supports traditional SnPb assembly for specified industrial, legacy, or other applications where lead-free assembly is not required and SnPb use is permitted.
Inspection, Testing & Quality Validation
Inspection and testing are defined according to your board design, component packages, quality criteria, and required test coverage. Available capabilities and records include:
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Automated & Visual Inspection: Solder Paste Inspection (SPI), 100% AOI on all SMT and THT assemblies, X-ray inspection for BGA, MicroBGA, and other hidden solder joints where applicable, and visual inspection for solder paste, component placement, and visible solder-joint conditions.
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Electrical & Safety Testing: Depending on your project requirements, testing can include In-Circuit Test (ICT), Flying Probe Testing, Hi-Pot Testing, and Leakage Current Testing to verify circuit connectivity, insulation performance, and electrical safety requirements.
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Functional Testing: Verification of the board’s operational logic, electrical behavior, and performance under defined test conditions.
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Structural & Material Validation: Bonding Pull Test, Solderability Test, and Coating Thickness Measurement can be provided where required to evaluate bonding strength, solderability, and coating conditions.
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Specialized Records & Analysis: Carbon Resistance Measurement Records and Ionic Contamination Test Reports can be provided when applicable to your project requirements.
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Environmental Stress & Reliability Testing: Thermal Stress Testing, Burn-In Testing, and Environmental Stress Screening (ESS) can be performed under defined stress conditions to support reliability validation and evaluation of early-life failure risk.
