PCB Assembly Capability
At Regulus, we offer specialized manufacturing solutions tailored to the rigorous demands of the global electronics industry. Our PCB assembly services combine advanced process control with versatile technical infrastructure, ensuring that your complex designs transition from engineering concepts to high-reliability products.
Types of Assembly & Scalable Quantity
We provide a flexible manufacturing environment that supports diverse project requirements, ranging from initial prototype development to full-scale mass production.
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SMT Assembly: Automated high-speed placement lines for modern high-density designs.
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THT / DIP Assembly: Reliable through-hole and DIP soldering for power-heavy or mechanically stressed applications.
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Mixed Technology: Integrated SMT and THD techniques on single or double-sided boards.
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Flexible Volume: We handle everything from engineering prototypes and low-volume batches to consistent high-volume runs.
Extensive Component Expertise
Our facility is equipped to handle a wide array of component technologies, ensuring precise placement for even the most challenging footprints:
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Small Form Factor: Expertise in passive parts as small as 0201 size.
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Integrated Circuits: Professional handling of SOIC, PLCC, QFP, and QFN packages.
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Advanced Packaging: High-precision mounting and reflow for BGA, UBGA, and POP (Package on Package) technologies.
Integrated Assembly Process & Compliance
Environmental sustainability and functional reliability are at the core of our PCB assembly workflow. We offer:
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Lead-free Assembly (RoHS): Full compliance with environmental regulations using specialized materials and thermal profiling.
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Leaded Process: Supporting traditional SnPb requirements for specific industrial or legacy applications.
Rigorous Testing & Quality Validation
To ensure product integrity, we maintain a comprehensive validation suite. We provide detailed reports and diagnostic checks based on your specific quality standards:
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Automated & Visual Inspection: Utilizing AOI and X-Ray Inspection to detect hidden defects and ensure solder joint quality.
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Electrical & Safety Testing: Including In-circuit test (ICT), Flying probe, and HI-POT testing. We also perform Leakage Current Testing to ensure electrical safety and insulation integrity.
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Functional Testing: Comprehensive verification of the board's operational logic and performance under simulated real-world conditions.
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Structural & Material Validation: Bonding Pull Test, Solderability Test, and Coating Thickness reports.
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Specialized Records & Analysis: We provide Carbon Resistance Record for specialized conductive requirements and Ionic Contamination Test Report to verify the cleanliness of the assembly process.
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Environmental Stress: Thermal Stress reports and Burn-in test to guarantee long-term performance and reliability.
