PCB Assembly Capability
At Regulus, we offer specialized manufacturing solutions tailored to the rigorous demands of the global electronics industry. Our PCB assembly services combine advanced process control with versatile technical infrastructure, ensuring that your complex designs transition from engineering concepts to high-reliability products.
Types of Assembly & Scalable Quantity
We provide a flexible manufacturing environment that supports diverse project requirements, ranging from initial prototype development to full-scale mass production.
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SMT Assembly: Automated high-speed placement lines for compact, high-density PCB designs requiring precise component placement.
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THT / DIP Assembly: Reliable through-hole and DIP soldering for power-heavy, connector-based, or mechanically stressed applications.
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Press-Fit Assembly: Solderless press-fit insertion for compliant-pin components that require strong mechanical retention and reliable electrical contact.
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Mixed Technology: Integrated SMT, THT / DIP, and Press-Fit assembly processes for complex boards that combine surface-mount components, through-hole parts, and solderless interconnects.
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Double-Sided Population: Component placement and soldering on both sides of the PCB to support higher circuit density and more compact product designs.
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Flexible Volume: We handle everything from engineering prototypes and low-volume batches to consistent high-volume runs.
Extensive Component Expertise
Our facility is equipped to handle a wide array of component technologies, ensuring precise placement for even the most challenging footprints:
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Small Form Factor: Expertise in passive parts as small as 0201 size.
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Integrated Circuits: Professional handling of SOIC, PLCC, QFP, and QFN packages.
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Advanced Packaging: High-precision mounting and reflow for BGA, UBGA, and POP (Package on Package) technologies.
Integrated Assembly Process & Compliance
Environmental sustainability and functional reliability are at the core of our PCB assembly workflow. We offer:
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Lead-free Assembly (RoHS): Full compliance with environmental regulations using specialized materials and thermal profiling.
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Leaded Process: Supporting traditional SnPb requirements for specific industrial or legacy applications.
Rigorous Testing & Quality Validation
To ensure product integrity, we maintain a comprehensive inspection and validation process. We provide diagnostic checks, measurement records, and test reports based on your specific quality standards:
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Automated & Visual Inspection: Using Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), X-Ray Inspection, and Visual Inspection to verify solder paste quality, component placement, visible solder joints, and hidden solder defects.
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Electrical & Safety Testing: Including In-Circuit Test (ICT), Flying Probe Testing, Hi-Pot Testing, and Leakage Current Testing to verify circuit connectivity, insulation performance, and electrical safety requirements.
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Functional Testing: Comprehensive verification of the board’s operational logic, electrical behavior, and performance under defined test conditions.
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Structural & Material Validation: Including Bonding Pull Test, Solderability Test, and Coating Thickness Measurement to confirm bonding strength, solderability, and coating consistency.
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Specialized Records & Analysis: Providing Carbon Resistance Measurement Records for specialized conductive requirements and Ionic Contamination Test Reports to verify assembly cleanliness.
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Environmental Stress & Reliability Testing: Including Thermal Stress Testing, Burn-In Testing, and Environmental Stress Screening (ESS) to evaluate product stability, early-life failure risk, and reliability under defined stress conditions.
