What is a flexible PCB or FPC?

A flexible printed circuit (FPC), commonly referred to as a flexible PCB, is built on a flexible substrate that allows the circuit to bend or fold for compact or space-constrained electronic designs. It can reduce wiring complexity, weight, and installation space.

What materials are used for flexible PCBs?

Common flex PCB materials include Polyimide (PI) and Polyester (PET). Material selection depends on temperature, flexibility, electrical performance, and application requirements.

Can REGULUS support multilayer flexible PCB manufacturing?

Yes. REGULUS supports single-sided, double-sided, and multilayer flexible PCBs, including fine-line and high-density FPC structures, subject to technical review and applicable manufacturing capabilities.

Can flexible PCBs support controlled impedance?

Yes. Controlled-impedance FPC can be evaluated based on the circuit design, stack-up, materials, trace geometry, and specified impedance tolerance.

Can REGULUS support flexible PCB prototypes and production?

Yes. REGULUS supports FPC prototypes, engineering builds, pilot production, and volume manufacturing according to project technical requirements, quantities, and applicable manufacturing capabilities.

Flexible PCB Manufacturing for Single- and Multilayer FPC

REGULUS supports flexible PCB manufacturing through qualified manufacturing partners. Flexible printed circuits (FPCs), commonly referred to as flexible PCBs, can be produced in single-sided, double-sided, and multilayer structures, including HDI structures for applicable designs.

We review your FPC design data, board structure, materials, fabrication requirements, quantities, quality requirements, and target schedule to coordinate an applicable manufacturing source before quotation. Applicable fabrication requirements are confirmed again before production release. Support can continue from initial design review through prototype and volume fabrication as your project develops.

FPC Fabrication Capabilities

Available FPC fabrication capabilities cover prototype and volume requirements for single-sided, double-sided, and multilayer flexible circuits, including HDI structures for designs requiring higher interconnection density.

Key fabrication conditions can include:

Circuit structure: Single-sided, double-sided, and multilayer FPC, including microvia-based HDI structures where required
Fine features: Line width and spacing for standard and HDI flexible PCB designs
Materials and construction options: Polyimide (PI), polyester (PET), coverlay, and stiffeners as applicable
Thin and lightweight constructions: Flexible PCB materials and structures can support compact and space-constrained product designs.
Electrical requirements: Controlled impedance based on specified targets, stack-up, trace geometry, and tolerances

The capability table below summarizes available standard and HDI FPC fabrication ranges. Final feasibility is confirmed against your Gerber files and fabrication specifications.

FPC capability table with panel size, layer count, copper, line width, vias, coverlay, stiffeners, and impedance.

FPC Stack-Up Structures

An FPC stack-up defines the arrangement of flexible substrates, copper layers, adhesive layers, coverlay, and other structural materials within the circuit. The applicable construction depends on layer count, copper thickness, substrate materials, via structure, stiffener requirements, and controlled-impedance requirements where applicable.

Single-Sided FPC: One conductive layer for simple routing and lightweight flexible applications.
Double-Sided FPC: Conductive layers on both sides, with plated through holes (PTH) used where interlayer connection is required.
Multilayer FPC: Multiple conductive layers for higher routing density and more complex interconnections.
Material Options: Polyimide (PI) and Polyester (PET) substrates can be evaluated according to thermal, mechanical, and electrical requirements.

The applicable stack-up is confirmed against your FPC design and fabrication specifications.

FPC stack-up structures for single-sided, double-sided, multilayer, and blind-via flexible circuits.

FPC Products Portfolio

Flexible PCBs are commonly used across applications where compact routing, low weight, or flexible interconnection is required. Typical applications can include:

Consumer Electronics: Smartphones, wearables, and laptop hinge circuits
Communication & Instrumentation: Networking hardware and precision sensor interfaces
Power & Energy: Battery management systems (BMS) and solar modules
Industrial & Automotive: Controllers and automotive display interconnects

The examples below show flexible printed circuit boards from our projects with different form factors, routing layouts, and mechanical configurations.

Flexible PCB sample with multiple branches and connector pads.

Circular flexible PCB sample with curved routing and connector tail.

Long narrow flexible PCB sample with straight routing and end pads.

Coiled flexible PCB sample with curved traces and connector pads.

Elongated flexible PCB sample with a narrow center section and end connectors.

Panelized flexible PCB array with multiple repeated circuit patterns.

Start Your Flexible PCB Fabrication Review

Preparing an FPC RFQ? Please submit your completed Product Survey, PCB/FPC Description File, Gerber files, required quantities, and applicable special fabrication requirements through our PCB Inquiry.

We will review your project information and clarify any engineering or fabrication questions needed before quotation.

PCB Inquiry

Flexible PCB FAQ

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