PCBA Manufacturing: SMT Process, THT Assembly & Quality Testing
To ensure every PCB assembly we provide maintains stable and excellent quality, Regulus is equipped with advanced machinery for a comprehensive PCBA manufacturing workflow. Our facility integrates high-precision SMT process lines, robust THT assembly capabilities, and rigorous quality control standards to meet the diverse technical requirements of our global partners.
Surface Mount Technology (SMT) Process
Our surface mount technology lines utilize high-precision automated equipment to ensure optimal placement and soldering integrity for high-density electronic assemblies. The SMT process is highly optimized for efficiency and reliability:
1. Solder Paste Printing
Utilizing automatic solder paste printers to achieve precise deposition for consistent joint quality.
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2. Solder Paste Inspection (SPI)
Our 3D solder paste inspection machines verify paste volume and alignment before SMT assembly to prevent defects at the source.
3. SMT Placement
High-speed mounters accurately place a wide range of components, from micro-sized passives to complex ICs.
4. Reflow Soldering
Controlled thermal profiling in our reflow oven ensures reliable mechanical and electrical bonding during the reflow soldering stage.
5. Visual Inspection
Preliminary manual checks to ensure structural alignment and placement accuracy.
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6. Automated Optical Inspection (AOI)
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Advanced automated optical inspection equipment scans every board to detect potential soldering or placement anomalies.
7. X-Ray Inspection (As Required)
For BGA and other bottom-terminated components, our X-Ray inspection system provides non-destructive validation of hidden solder joints.
Through-Hole Technology (THT) Process
For components requiring superior mechanical strength or power-heavy applications, our THT workflow ensures robust and reliable connectivity.
1. THT & DIP Assembly
Our dedicated lines feature skilled technicians who perform precise component insertion for both standard through-hole and DIP (Dual In-line Package) components, ensuring robust mechanical connections.
2. Wave Soldering
Professional wave soldering machines create strong, uniform solder joints for through-hole components.
3. Automated Optical Inspection (AOI)
Post-soldering AOI validation ensures that THT joints meet defined quality standards.
4. Visual Inspection
Detailed manual verification using high-magnification tools to ensure cosmetic and structural integrity.
Testing & Quality Control
Final validation is the cornerstone of our PCBA manufacturing process, ensuring that every product performs according to its technical specifications.
1. In Circuit Test (ICT)
Utilizing specialized inspection machines to perform an in circuit test, verifying component values and circuit continuity.
2. Functional Testing
Our functional test stations simulate real-world operational conditions to confirm the board’s logical performance through comprehensive functional testing.
3. Final Visual Inspection
A thorough manual review of the finished assembly before packaging to ensure cosmetic and structural integrity.
Outgoing Quality Control (OQC)
Every shipment is accompanied by a professional OQC report, documenting our commitment to zero-defect manufacturing and full compliance with customer requirements.